Mechanical XG-Z40 Synthetic High Flux BGA Solder Cream Tin Solder Paste 10ml Solder Paste Tin Applicable to PCB BGA SMD PGA repair. Mechanic Solder Tin Paste xg-z40 Solder Paste Flux Sn63 / Pb37 25-45um Syringe For Mobile Phone Indust Repair Services
Mechanical XG-Z40 Synthetic High Flux BGA Solder Paste BGA Tin Cream for Soldering
PCB BGA solder paste flux bag solder ball flux paste
BGA flux solder paste is high viscosity unclean flux can be used for PCB SMD rework can be used for soldering and reballing of computers and phone chips.
It is the mix of high quality alloyed powder and resin pasty flux it can avoid pale yellow residue so it is easy to clean the board.
Solder paste for mobile phone PCB and SMD etc.
Helps repair circuit boards and protect electronic components
A necessary material to repair the mobile phone motherboard
Flux solder paste - no need to clean solder
Specifications:
- Material: tin + solder paste
- Color: as shown in the picture
- Size: approx. 1.30 * 1.30 * 1.14 inch / 3.3 * 3.2 * 2.9 cm
- Type: XG-Z40
- Alloy: Sn63 / Pb37
- Microns: 25-45um
Package Includes:
1 x Mechanic Solder Paste in Syringe